💨 Abstract
Nvidia continues to demand advanced packaging from TSMC, shifting focus from CoWoS-S to CoWoS-L for its AI chip, Blackwell. The demand is increasing capacity into CoWoS-L, not reducing it. Nvidia has been selling its Blackwell chips as fast as TSMC can produce them, with packaging remaining a bottleneck due to capacity constraints.
Courtesy: theprint.in
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